It is understood that Foxconn, which has reaped great rewards at GB200 this time, will also use COMPUTEX to showcase its long-term accumulated technical capabilities in the fields of components, heat dissipation and cabinets.

The server-related cooperation between Foxconn and NVIDIA began as early as 2017, when the industry's first HGX series was assisted by Foxconn.

However, the market has not been very clear about the relationship between Foxconn and NVDIA until the first batch of GB200 cooperation lists were announced, which made the outside world realize that Foxconn has been planning in related fields for a long time.

It is understood that this time Foxconn has orders for three new product categories: NVL72, NVL36 and HGX B200, and will devote all its efforts to shipping them from the second half of the third quarter of 2024.

Supply chain players all said that since the GB200 series products will be shipped in cabinets, and the server and switch parts are mainly controlled by NVIDIA itself, the higher the degree of integration among players, the stronger their competitiveness will be.

Currently, when companies in the market, including Quanta, Inventec, and Wistron, mention GB200, they often emphasize their own system integration capabilities. This shows that the ability to integrate a complete cabinet has become the key to competition, whether it is for winning orders or creating profits.

In order to further let the market understand Foxconn's relevant technical strength, Foxconn will use Hongbai Technology to show the full range of strength in GB200 cabinets at this COMPUTEX exhibition. It is understood that the complete cabinet physical products including liquid cooling system and power supply system will be displayed on site to assist customers in customized design.

In addition to its ability to design and produce complete cabinets, Foxconn also has two other aspects of its GB200 series products that are difficult for other companies to match.

Market players pointed out that since GB200 is shipped in the form of a complete cabinet, as the production volume increases, both the production environment and production scale will require certain support, including the integrity of related infrastructure and supply chain.

Especially in terms of supply chain integrity, relevant industry players said that Foxconn mentioned in a previous legal briefing that AI servers are currently mainly operated on a buy & sell business model. Therefore, if industry players can master more technical and necessary sub-system capabilities such as heat dissipation, they can not only provide more customized designs, but also help increase profits.

After all, GB200 is shipped in cabinets, but unless it is a brand new data center, if a GB200 cabinet is to be placed in an existing data center, a customized design may be required considering the needs for heat dissipation and other aspects.

If components and key subsystems need to be purchased from outside, the degree of customization generated by the corresponding environmental requirements will inevitably be affected; or continuous revisions will be required to meet the customized design, which will affect the overall production schedule.

Since Foxconn emphasizes that it has complete design and production capabilities in both heat dissipation and components, it can not only provide exclusive customized designs based on the respective needs of different customers, but also significantly shorten the design and production time. For customers, this is also another contribution to improving competitiveness.

These valuable technical experiences and resources that were previously hidden within the group will also be displayed to the public through COMPUTEX with the launch of GB200.